On 2024-9-30 Global Info Research released【Global Fan-out Panel-level Packaging Market 2024 by Manufacturers, Regions, Type and Application, Forecast to 2030】. This report includes an overview of the development of the Fan-out Panel-level Packaging industry chain, the market status of Consumer Electronics (Nickel-Zinc Ferrite Core, Mn-Zn Ferrite Core), Household Appliances (Nickel-Zinc Ferrite Core, Mn-Zn Ferrite Core), and key enterprises in developed and developing market, and analysed the cutting-edge technology, patent, hot applications and market trends of Fan-out Panel-level Packaging.
According to our (Global Info Research) latest study, the global Fan-out Panel-level Packaging market size was valued at USD 1409.5 million in 2023 and is forecast to a readjusted size of USD 4721.9 million by 2030 with a CAGR of 18.9% during review period.
The global market for semiconductor was estimated at US$ 579 billion in the year 2022, is projected to US$ 790 billion by 2029, growing at a CAGR of 6% during the forecast period. Although some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.76%, Sensor with 16.31%, and Logic with 14.46% growth, Memory declined with 12.64% year over year. The microprocessor (MPU) and microcontroller (MCU) segments will experience stagnant growth due to weak shipments and investment in notebooks, computers, and standard desktops. In the current market scenario, the growing popularity of IoT-based electronics is stimulating the need for powerful processors and controllers. Hybrid MPUs and MCUs provide real-time embedded processing and control for the topmost IoT-based applications, resulting in significant market growth. The Analog IC segment is expected to grow gradually, while demand from the networking and communications industries is limited. Few of the emerging trends in the growing demand for Analog integrated circuits include signal conversion, automotive-specific Analog applications, and power management. They drive the growing demand for discrete power devices.
The Global Info Research report includes an overview of the development of the Fan-out Panel-level Packaging industry chain, the market status of Wireless Devices (System-in-package (SiP), Heterogeneous Integration), Power Management Units (System-in-package (SiP), Heterogeneous Integration), and key enterprises in developed and developing market, and analysed the cutting-edge technology, patent, hot applications and market trends of Fan-out Panel-level Packaging.
Regionally, the report analyzes the Fan-out Panel-level Packaging markets in key regions. North America and Europe are experiencing steady growth, driven by government initiatives and increasing consumer awareness. Asia-Pacific, particularly China, leads the global Fan-out Panel-level Packaging market, with robust domestic demand, supportive policies, and a strong manufacturing base.
Sample Report Request Fan-out Panel-level Packaging
https://www.globalinforesearch.com/reports/1705994/fan-out-panel-level-packaging
Market segment by Type： System-in-package (SiP)、Heterogeneous Integration
Market segment by Application：Wireless Devices、Power Management Units、Radar Devices、Processing Units、Others
Major players covered： Amkor Technology、Deca Technologies、Lam Research Corporation、Qualcomm Technologies、Siliconware Precision Industries、SPTS Technologies、STATS ChipPAC、Samsung、TSMC
Market segment by region, regional analysis covers: North America (United States, Canada and Mexico), Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe), Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia),South America (Brazil, Argentina, Colombia, and Rest of South America),Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa).
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe Fan-out Panel-level Packaging product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top manufacturers of Fan-out Panel-level Packaging, with price, sales, revenue and global market share of Fan-out Panel-level Packaging from 2019 to 2024.
Chapter 3, the Fan-out Panel-level Packaging competitive situation, sales quantity, revenue and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Fan-out Panel-level Packaging breakdown data are shown at the regional level, to show the sales quantity, consumption value and growth by regions, from 2019 to 2030.
Chapter 5 and 6, to segment the sales by Type and application, with sales market share and growth rate by type, application, from 2019 to 2030.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value and market share for key countries in the world, from 2017 to 2023.and Fan-out Panel-level Packaging market forecast, by regions, type and application, with sales and revenue, from 2025 to 2030.
Chapter 12, market dynamics, drivers, restraints, trends and Porters Five Forces analysis.
Chapter 13, the key raw materials and key suppliers, and industry chain of Fan-out Panel-level Packaging.
Chapter 14 and 15, to describe Fan-out Panel-level Packaging sales channel, distributors, customers, research findings and conclusion.
Data Sources:
About Us:
GlobaI Info Research
Web: https://www.globalinforesearch.com
CN: 0086-176 6505 2062
HK: 00852-58030175
US: 001-347 966 1888
Email: report@globalinforesearch.com
Global Info Research is a company that digs deep into global industry information to support enterprises with market strategies and in-depth market development analysis reports. We provides market information consulting services in the global region to support enterprise strategic planning and official information reporting, and focuses on customized research, management consulting, IPO consulting, industry chain research, database and top industry services. At the same time, Global Info Research is also a report publisher, a customer and an interest-based suppliers, and is trusted by more than 30,000 companies around the world. We will always carry out all aspects of our business with excellent expertise and experience.