On 2024-9-14 Global Info Research released【Global Wafer Grinding and Dicing Service Market 2024 by Manufacturers, Regions, Type and Application, Forecast to 2030】. This report includes an overview of the development of the Wafer Grinding and Dicing Service industry chain, the market status of Consumer Electronics (Nickel-Zinc Ferrite Core, Mn-Zn Ferrite Core), Household Appliances (Nickel-Zinc Ferrite Core, Mn-Zn Ferrite Core), and key enterprises in developed and developing market, and analysed the cutting-edge technology, patent, hot applications and market trends of Wafer Grinding and Dicing Service.
Wafer backgrinding, also known as Wafer thinning, is a semiconductor device fabrication step during which wafer thickness is reduced to allow for stacking and high density packaging of integrated circuits (IC).
The global Wafer Grinding and Dicing Service market size is expected to reach $ 1014 million by 2030, rising at a market growth of 9.0% CAGR during the forecast period (2024-2030).
Global key players of Wafer Grinding and Dicing Service include Micross Components, QP Technologies, Integra Technologies, Suzhou Baikejing Electronic Technology, YoungTek Electronics Corp., etc. The top five players hold a share about 26%. Asia-Pacific is the largest market, and has a share about 73%, followed by North America and Europe with share 17% and 8%, separately. In terms of product type, 300mm Wafer is the largest segment, occupied for a share of 78%. In terms of application, Logic Chip is the largest field with a share about 36 percent.
This report studies the global Wafer Grinding and Dicing Service production, demand, key manufacturers, and key regions.
This report is a detailed and comprehensive analysis of the world market for Wafer Grinding and Dicing Service and provides market size (US$ million) and Year-over-Year (YoY) Growth, considering 2023 as the base year. This report explores demand trends and competition, as well as details the characteristics of Wafer Grinding and Dicing Service that contribute to its increasing demand across many markets.
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https://www.globalinforesearch.com/reports/2282912/wafer-grinding-and-dicing-service
Market segment by Type： 300mm Wafer、200mm Wafer、Others
Market segment by Application：Memory Chip、Logic Chip、Optical Sensor、MEMS、Others
Major players covered： Suzhou Baikejing Electronic Technology、Yima Semiconductor、Universen Hitec ltd、YoungTek Electronics Corp.、Integrated Service Technology Inc (iST)、Chnchip Integrated Circuit Co.,Ltd、Guangdong Leadyo IC Testing、King Long Technology、Shanghai Fine Chip Semiconductor、Jiangsu Nepes Semiconductor、Innotronix、Qipu Electronic Technology (Nantong) Co., Ltd、Micross Components、QP Technologies、Integra Technologies、MPE, Inc. (Micro Precision Engineering)、SVM (Silicon Valley Microelectronics)、GDSI (Grinding & Dicing Services Inc.)、Syagrus Systems、APD (American Precision Dicing, Inc)、Optim Wafer Services、NICHIWA KOGYO CO.,LTD.、High Components Aomori, Inc、FuRex、Intech Technologies International
Market segment by region, regional analysis covers: North America (United States, Canada and Mexico), Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe), Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia),South America (Brazil, Argentina, Colombia, and Rest of South America),Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa).
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe Wafer Grinding and Dicing Service product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top manufacturers of Wafer Grinding and Dicing Service, with price, sales, revenue and global market share of Wafer Grinding and Dicing Service from 2019 to 2024.
Chapter 3, the Wafer Grinding and Dicing Service competitive situation, sales quantity, revenue and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Wafer Grinding and Dicing Service breakdown data are shown at the regional level, to show the sales quantity, consumption value and growth by regions, from 2019 to 2030.
Chapter 5 and 6, to segment the sales by Type and application, with sales market share and growth rate by type, application, from 2019 to 2030.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value and market share for key countries in the world, from 2017 to 2023.and Wafer Grinding and Dicing Service market forecast, by regions, type and application, with sales and revenue, from 2025 to 2030.
Chapter 12, market dynamics, drivers, restraints, trends and Porters Five Forces analysis.
Chapter 13, the key raw materials and key suppliers, and industry chain of Wafer Grinding and Dicing Service.
Chapter 14 and 15, to describe Wafer Grinding and Dicing Service sales channel, distributors, customers, research findings and conclusion.
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