On 2024-10-11 Global Info Research released【Global Printed Circuit Board Laminate Market 2024 by Manufacturers, Regions, Type and Application, Forecast to 2030】. This report includes an overview of the development of the Printed Circuit Board Laminate industry chain, the market status of Consumer Electronics (Nickel-Zinc Ferrite Core, Mn-Zn Ferrite Core), Household Appliances (Nickel-Zinc Ferrite Core, Mn-Zn Ferrite Core), and key enterprises in developed and developing market, and analysed the cutting-edge technology, patent, hot applications and market trends of Printed Circuit Board Laminate.
According to our (Global Info Research) latest study, the global Printed Circuit Board Laminate market size was valued at USD million in 2023 and is forecast to a readjusted size of USD million by 2030 with a CAGR of % during review period.
Lamination is a technique wherein the material is permanently assembled by heating, pressuring, welding, or by use of adhesives. This technique improves the properties of a material such as strength, durability, appearance, stability, and others. Printed circuit board (PCB) laminate involves lamination of a circuit with a non-conductive material. PCB laminates connect and support the electronic components using pads, conductive tracks, and other features etched from copper sheets laminated onto a non-conductive substrate. PCB laminations are widely used in one copper layer PCB, two copper layer PCB, or outer & inner layer PCB.
According to our Semiconductor Research Center, the global total output value of PCB was about US$ 81 billion in 2022. With strong drivers from new technology, such as AI, 5G and new energy vehicles, it is estimated that the PCB industry will continue to grow steadily in the next six years. Global PCB manufacturers are mainly located in China mainland, China Taiwan, Japan, South Korea, Europe and the United States. Among them, Chinese local PCB companies hold the biggest share.
The Global Info Research report includes an overview of the development of the Printed Circuit Board Laminate industry chain, the market status of Automotive (FR-4, High Tg Epoxy), Communications (FR-4, High Tg Epoxy), and key enterprises in developed and developing market, and analysed the cutting-edge technology, patent, hot applications and market trends of Printed Circuit Board Laminate.
Regionally, the report analyzes the Printed Circuit Board Laminate markets in key regions. North America and Europe are experiencing steady growth, driven by government initiatives and increasing consumer awareness. Asia-Pacific, particularly China, leads the global Printed Circuit Board Laminate market, with robust domestic demand, supportive policies, and a strong manufacturing base.
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https://www.globalinforesearch.com/reports/1708363/printed-circuit-board-laminate
Market segment by Type： FR-4、High Tg Epoxy、BT Epoxy、Polyimide、Copper Clad、Teflon、Other
Market segment by Application：Automotive、Communications、Industrial Electronics、Consumer Electronics、Aerospace & Defense、Others
Major players covered： Unimicron Technology Corp.、Nippon Mektron、Samsung Electro-Mechanics、Zhen Ding Technology Holding Limited、Young Poong Electronics Co., Ltd.、Daeduck Electronics Co., Ltd.、Ibiden Co., Ltd.、Tripod Technology Corporation、TTM Technologies, Inc.、Austria Technologie & Systemtechnik AG
Market segment by region, regional analysis covers: North America (United States, Canada and Mexico), Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe), Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia),South America (Brazil, Argentina, Colombia, and Rest of South America),Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa).
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe Printed Circuit Board Laminate product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top manufacturers of Printed Circuit Board Laminate, with price, sales, revenue and global market share of Printed Circuit Board Laminate from 2019 to 2024.
Chapter 3, the Printed Circuit Board Laminate competitive situation, sales quantity, revenue and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Printed Circuit Board Laminate breakdown data are shown at the regional level, to show the sales quantity, consumption value and growth by regions, from 2019 to 2030.
Chapter 5 and 6, to segment the sales by Type and application, with sales market share and growth rate by type, application, from 2019 to 2030.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value and market share for key countries in the world, from 2017 to 2023.and Printed Circuit Board Laminate market forecast, by regions, type and application, with sales and revenue, from 2025 to 2030.
Chapter 12, market dynamics, drivers, restraints, trends and Porters Five Forces analysis.
Chapter 13, the key raw materials and key suppliers, and industry chain of Printed Circuit Board Laminate.
Chapter 14 and 15, to describe Printed Circuit Board Laminate sales channel, distributors, customers, research findings and conclusion.
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