On 2025-3-18 Global Info Research released【Global Semiconductor Advanced Packaging Materials Market 2025 by Manufacturers, Regions, Type and Application, Forecast to 2031】. This report includes an overview of the development of the Semiconductor Advanced Packaging Materials industry chain, the market status of Consumer Electronics (Nickel-Zinc Ferrite Core, Mn-Zn Ferrite Core), Household Appliances (Nickel-Zinc Ferrite Core, Mn-Zn Ferrite Core), and key enterprises in developed and developing market, and analysed the cutting-edge technology, patent, hot applications and market trends of Semiconductor Advanced Packaging Materials.
According to our (Global Info Research) latest study, the global Semiconductor Advanced Packaging Materials market size was valued at US$ 14010 million in 2024 and is forecast to a readjusted size of USD 28490 million by 2031 with a CAGR of 10.0% during review period.
Traditional semiconductor packaging materials mainly include packaging substrates, lead frames, bonding wires, ceramic packaging materials, chip bonding materials, etc. The packaging materials in the advanced packaging field (FC, WB, WLCSP, etc.) are mainly packaging substrates (ABF), underfill, die attach materials (paste and wire), epoxy molding compounds, etc.
This report is a detailed and comprehensive analysis for global Semiconductor Advanced Packaging Materials market. Both quantitative and qualitative analyses are presented by company, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.
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Market segment by Type： FC Package Substrate (FC-CSP and ABF)、WB Package Substrate (WB-BGA)、Underfill、Die Attach Material (Paste and Wire)、Epoxy Molding Compound、Others
Market segment by Application：Consumer Electronics、Automotive、IoT、5G、High Performance Computing、Others
Major players covered： Unimicron、Ibiden、Nan Ya PCB、Shinko Electric Industries、Kinsus Interconnect、AT&S、Semco、Kyocera、TOPPAN、Zhen Ding Technology、Daeduck Electronics、Zhuhai Access Semiconductor、LG InnoTek、Shennan Circuit、Shenzhen Fastprint Circuit Tech、Henkel、Won Chemical、NAMICS、Resonac、Panasonic、MacDermid Alpha、Shin-Etsu Chemical、Sunstar、Fuji Chemical、Zymet、Threebond、AIM Solder、LORD Corporation、SMIC Senju Metal Industry Co., Ltd、Shenmao Technology、Heraeu、Sumitomo Bakelite、Indium、Tamura、Shanghai Doitech、KCC、Eternal Materials、NAGASE、Hysol Huawei Electronics、Jiangsu HHCK Advanced Materials
Market segment by region, regional analysis covers: North America (United States, Canada and Mexico), Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe), Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia),South America (Brazil, Argentina, Colombia, and Rest of South America),Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa).
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe Semiconductor Advanced Packaging Materials product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top manufacturers of Semiconductor Advanced Packaging Materials, with price, sales, revenue and global market share of Semiconductor Advanced Packaging Materials from 2020 to 2025.
Chapter 3, the Semiconductor Advanced Packaging Materials competitive situation, sales quantity, revenue and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Semiconductor Advanced Packaging Materials breakdown data are shown at the regional level, to show the sales quantity, consumption value and growth by regions, from 2020 to 2031.
Chapter 5 and 6, to segment the sales by Type and application, with sales market share and growth rate by type, application, from 2020 to 2031.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value and market share for key countries in the world, from 2020 to 2024.and Semiconductor Advanced Packaging Materials market forecast, by regions, type and application, with sales and revenue, from 2025 to 2031.
Chapter 12, market dynamics, drivers, restraints, trends and Porters Five Forces analysis.
Chapter 13, the key raw materials and key suppliers, and industry chain of Semiconductor Advanced Packaging Materials.
Chapter 14 and 15, to describe Semiconductor Advanced Packaging Materials sales channel, distributors, customers, research findings and conclusion.
Data Sources:
Via authorized organizations:customs statistics, industrial associations, relevant international societies, and academic publications etc.
Via trusted Internet sources.Such as industry news, publications on this industry, annual reports of public companies, Bloomberg Business, Wind Info, Hoovers, Factiva (Dow Jones & Company), Trading Economics, News Network, Statista, Federal Reserve Economic Data, BIS Statistics, ICIS, Companies House Documentsm, investor presentations, SEC filings of companies, etc.
Via interviews. Our interviewees includes manufacturers, related companies, industry experts, distributors, business (sales) staff, directors, CEO, marketing executives, executives from related industries/organizations, customers and raw material suppliers to obtain the latest information on the primary market;
Via data exchange. We have been consulting in this industry for 16 years and have collaborations with the players in this field. Thus, we get access to (part of) their unpublished data, by exchanging with them the data we have.
From our partners.We have information agencies as partners and they are located worldwide, thus we get (or purchase) the latest data from them.
Via our long-term tracking and gathering of data from this industry.We have a database that contains history data regarding the market.
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